Modules

Semiconductor modules enable dynamic performance of devices to be modelled in one, two and three dimensions, together with circuit-based modelling of active and passive devices.

Engineers often prefer using semiconductor power modules over discrete because power modules have an electrically isolated baseplate with four bolt-holes which makes thermal interfacing much more straightforward. Power modules have a direct bonded copper (DBC) substrate which is used to interface between the semiconductor die and the thermal baseplate, providing very good thermal conductivity and high voltage isolation. Power modules provide a higher level of integration and is the simpler and more convenient approach to developing medium to high power converters/inverters. However, if you are trying to optimise cost and need a steady supply of components for higher volume production, then you may want to consider using discrete semiconductor packages.