28.11.2019
November 2019 – Dynex High Power IGBTs – Alternatives for ABB, Fuji, Semikron and Infineon parts
Published on: 28/11/2019
Discover Dynex’s alternatives to high power IGBTs from the world’s leading manufacturers
Dynex IGBT module with an isolated baseplate
GD Rectifiers are an official distributor for Dynex Semiconductors and distribute their comprehensive range of high power IGBT modules and fast recovery diodes.
Dynex offer industry leading high power IGBT modules from 750V, 1200V, 1700V, 3300V, 4500V and 6500V. Their high power IGBT modules provide class-leading robustness, low switching losses, high short circuit capability-wide SCSOA and high DC stability via advanced edge termination design and passivation. Dynex’s IGBT high power modules are robust and work with high reliability at any temperature condition, from -40/-50°C up to 150°C.
Dynex’s FRDs (fast recovery diodes) feature low conduction losses and thermal resistance, high voltage capability, high switching speed, low forward volt-drop and have an isolated AISiC Base with AIN substrates. The FRDs are available in 1.2kv, 1.8kv, 3.3kv, 4.5kv and 6.5kv in dual and triple diode modules. Dynex have predominantly designed these FRD modules for use in rail traction, industrial motor drives, induction heating and power generation. The FRD modules are designed to match and work as the input rectifiers for the existing Dynex range of IGBT modules.
Alternative High Power IGBTs
Dynex’s high power IGBTs can be used as an alternative to various Infineon, Mitsubishi, ABB, Semikron and Fuji devices. Please see below the recommended alternatives for the various parts below:
| Dynex Alternatives | Infineon | Mitsubishi | ABB | Semikron | Fuji |
| H1 | Primepack 3 (FF) | Semitrans 10 (SKMxxxxGBxxP/Rx) | Primepack X series – XXB/VXB | ||
| H2 | Primepack 2 (FF) | Primepack X series – XXA/VXA | |||
| M1 | Econodual (ME4) | T1 series | LoPak1 (R1) | SEMiX xxxGB | XNA series (2MBAxxxXNA) |
| 190×140 (E,A) and 140×130 (X, F, N) packages | IHM-B (FZ/FD/FF/DZ/DD) | H/X series (CMxxxxHC) | HiPak (5SNE – 190×140), (5SNA – 140×130) | SEMiX 3P | V & U series (1MBIxxxxV/U and 2MBIxxxxV/U) |
| SHV (open source) | XPH (FF-T3) | HV100 | LinPak (5SNG) | Semitrans 20 | HPnC – XUF |
| SLV | LV100 | HPnC – XVF |
Dynex Semiconductor High Power IGBT Range
Dynex H1 Series
TG1000HF17H1-S300
Dynex H2 Series
TG650HF17H2-S3
Dynex M1 Series
DIM2400ESM12-A
DIM1800ESM12-A
DIM1600FSM12-A
DIM1200FSM12-A
DIM800FSM12-A
DIM800DDM12-A
DIM800DCM12-A
DIM600DDM12-A
DIM400DDM12-A
DIM2400ESM17-A
DIM1600ECM17-A
DIM1600FSM17-A
DIM1200FSM17-A
DIM800FSM17-A
DIM800DCM17-A
DIM800DDM17-A
DIM600DDM17-A
DIM600DCM17-A
DIM400DCM17-A
DIM400DDM17-A
DIM400PHM17-A
DIM400PBM17-A
190×140 (E, A) and 140×130 (X, F, N) Packages
(E & A)
DIM2400ESM12-A
DIM1800ESM12-A
DIM2400ESM17-A
DIM1600ECM17-A
TIM2400ESM17-TSA
DIM1500ESM33-MS
DIM1500ESM33-TS
DIM1500ASM33-TS001
DIM1000ECM33-TS
DIM1000ACM33-TS001
DIM1500ESM33-TL
DIM1500ASM33-TL001
DIM1000ECM33-TL
DIM1000ACM33-TL001
DIM2000ESM33-UF
DIM1800ESM33
DIM1500ESM33-MF
DIM1200ASM45-TS
DIM1200ASM45-TS001
DIM1200ASM45-TL
DIM1200ASM45-TL001
DIM1500ASM45-UF
DIM1200ASM45-TF
DIM1200ASM45-TF001
DIM750ASM65-TS
DIM500ACM65-TS
DIM1000ASM65
DIM1200ASM65-UF
DIM750ASM65-TF
(X, F & N)
DIM1600FSM12-A
DIM1200FSM12-A
DIM800FSM12-A
DIM1600FSS12-A
DIM1200FSS12-A
DIM800FSS12-A
DIM1600FSM17-A
DIM1200FSM17-A
DIM800FSM17-A
TIM2400NSM17-TSA
TIM1600FSM17-PSA
DIM1000NSM33-TS
DIM100XSM33-TS001
DIM1000NSM33-TL
DIM1000XSM33-TL001
DIM800XSM45-TS
DIM800XSM45-TS001
DIM400XCM45-TS
DIM400XCM45-TS001
DIM400XSM45-TS
DIM400XM45-TS001
DIM800XSM45-TL
DIM800XSM45-TL001
DIM500XSM65-TS
DIM250XCM65-TS
SHV Open (Source)
High voltage packages 3.3kV to 6.5kV
Lower voltage packages up to 3.3kV
Product range in development, call GD Rectifiers on: 01444 243 452 for more information.
SLV
High voltage packages 3.3kV to 6.5kV
Lower voltage packages up to 3.3kV
Product range in development, call GD Rectifiers on: 01444 243 452 for more information.
GD Rectifiers also works closely with Dynex to offer custom IGBT modules, enhancing our range of power semiconductor devices, we have the capability to design, develop and manufacture a custom design tailored to your specification.
Dynex’s unique range of capabilities encompasses the following:
- Laser welded assemblies
- Ultrasonic welding processes
- Copper wire bonds
- Various die technologies (trench gate, SiC)
- Liquid cooled heatsinks
- Silver sintering
- Customised packaging (case materials)
- Hermetic sealed packages
Using their experience in the design and manufacture of IGBT modules, Dynex has helped customers by: reducing system cost, reducing total system size and weight, improving thermal characteristics, maximising system efficiency and operating in sever environments.
View Dynex’s Product Guide 2019 here
For further information on Dynex’s wide range of high power IGBT modules, including their alternatives to Infineon, Mitsubishi, ABB, Semikron and Fuji or to discuss customised IGBT solutions, please call us on: 01444 243 452 or email: enquiries@gdrectifiers.co.uk.
